Semi-Automatic 8inch Bond Module
This machine is intended to very accurately bond two wafer-scale substrates. Products of final thickness (total stack thickness) up to 6 mm can be processed and, on top of this, sub-micron alignment accuracy can be obtained (sub-micron accuracy in both shift and rotation is possible).
In order to limit expansion by heat LED devices are used for the UV-curing process.
Alignment occurs in full contact and it has a throughput of approximately 10 bonds per hour. The module can handle spacer plates, lens plates, intermediate imprinting products all very well.
Due to its design the machine is very useful in both test and production environment.
Project Smart Glass Tool delivered
In line production unit to produce “smartglass” for PeerPlus BV. Read more...UV-imprinting for Photovoltaics, Micro-optics, LED-packaging and Micro-fluidics
Wafer Based Solutions presented on the Photonics Event... Read more...Automatic imprint machine delivered
WBS has delivered a complete UV-imprinting, Read more...