Modern electronic devices such as cameras, mobile phones, gaming consoles, laptops, micro-optical systems, etc. are decisive interfaces between the real world and the micro-electronics of the image sensors inside camera modules. At present, the general concept of a camera module assembly undergoes a transition from discrete assembly to wafer-level integration using well-established semiconductor technologies. Wafer-level cameras have already started to replace conventional modules due to smaller form factors and lower cost performance ratios.
Wafer level cameras are devices in which all the individual parts are fabricated at wafer level where multiple products are still present on one and the same substrate. Before singularization, the wafer can be bonded in one or more steps to form a complete stack consisting of a CMOS image sensor and a full micro-optics stack.
UV imprint lithography, originally developed for cost-efficient replication of structures in the nanometer range, is now considered a powerful tool for the fabrication of wafer-level optics in highly parallel mass fabrication.
WBS offers a complete range of solutions. Coupled with process development and their own equipment, WBS provides a total solution from system configuration and fabrication up to process integration and material know-how.
Project Smart Glass Tool delivered
In line production unit to produce “smartglass” for PeerPlus BV. Read more...UV-imprinting for Photovoltaics, Micro-optics, LED-packaging and Micro-fluidics
Wafer Based Solutions presented on the Photonics Event... Read more...Automatic imprint machine delivered
WBS has delivered a complete UV-imprinting, Read more...